Carbon Nano Tube Interconnects for Hardware A...

ABSTRACT

This work proposes a method of application of Carbon Nano Tube (CNT) Structures for Chip Interconnectionsin place of conventional Copper/Aluminium Chip Interconnects for efficient and High-Performance Computing Hardware Systems. Simulations are made for analysing Current carryingcapacity and Number of Channels present per area of a Multi Walled Carbon Nano Tubes Bundle of 7 nm CNT size. Large conduction channels were observed at room temperature conditions and can be exploited for faster Interconnect speed thereby reducing the Process Latency and Electromigration

Keywords: Carbon Nanotubes, Interconnects, Conduction Channels, CNT Bundles